Back
to TME Resources List
Summary
Burst
and CTF Test Methods Quantify Your Process
Use SQC Methods for Destructive Testing
Test Repeatablility is Essential
Data Log and Analysis is Essential
There
are many test methodologies available for package
quality evaluation. The Burst and Creep to Failure
test provide you with quantifiable measurements.
When quantifiable measurements are used, the design
and process are capable of control.
By
using quantifiable test methodologies for seal
strength and applying SQC methods for destructive
methods a great deal of process control and quality
information becomes available.
For
example, in this Control Chart that is available
from quantifiable data such as we have discussed,
you can see both trends and process limit excesses.
This type of information gives the operator or
quality supervisor the ability to take action
before lot failure occurs.
My
major issue in Burst or Creep or Creep to Failure
testing is to be sure that you apply the most
consistent and repeatable test. Look at your total
system of instrument, delivery, package materials,
and operator. Determine the best procedures for
all the elements. If a failure occurs, don’t
jump to conclusions, investigate all the elements
of the test.
The
BT-1000 X-Bar Control Chart
|
The
BT-1000 Histogram
|
Finally,
keep accurate data logs. With this data you can
use your quality control statistics to aid in
your process and product analysis. Look for instruments
today that give you data directly from your test
or at least provide a means to down load the test
data from the test to a device that will log the
data.
An
appendix of references is available from T.M.
Electronics on a variety of test methods and related
articles.
Thank
you for your time and attention. I hope that some
of what I have said today provided a better understanding
of the details of Burst, Creep and Creep to Failure
testing for package seal strength.
This paper is presented courtesy
of TM Electronics, Inc.
Back
to TME Resources List
|
