Products - BT Integra-Pack©

Back to Product List

 

 

TME's New Intelligent
Package Test System

Burst, Creep, Creep-to-Failure, and Leak Integrity Tests

 

Brochure and Specification Sheet PDF

Request for Quotation or Information

The TME BT Integra-Pack© is a bench-top, high-resolution (0.001 psig) test instrument with a small footprint and user-friendly ease of operation. Electronic pressure and flow controls provide precise and repeatable test conditions, while automatic and high flow output allow testing of large porous packages. Applications cover a range of flexible or rigid, porous and non-porous, open or sealed packages.

Automatic or Manual
Parameter Definition

The intelligent BT Integra-Pack© will test any package in automatic mode, with no need to input test parameters. However, its sophisticated nature is combined with a manual mode that lets the user input parameters such as ramp rate control and back pressure drop sensitivity. This allows testing of special configurations or types of packages or perform specific research and data-gathering activities.

Icon-based, Touch-Driven Color Display
The touchscreen color display provides easy, clear navigation through the wide variety of data handling and review screens. Clearly defined icons make it easy to choose test modes, move from automatic to manual test settings, view test results in numeric and/or graphical format, and securely handle accumulated data.

The BT Integra-Pack is a definitive step forward for traditional burst testing. A completely integrated process control tool, the instrument is not only valuable at the point of testing, but is also able to transmit your data from direct process control to your quality department, making it a quality control tool as well. Its objective is to enable you to produce a package that is as valid as the product enclosed.

 

Standard Features

  • Complies with standards for all commonly-used Seal Strength and Package Integrity tests (Burst, Creep, Creep-to-Failure, and Leak Integrity)

  • Automatic Burst Test Mode
    • Results right out of the box, no lengthy setup
    • Senses package size during prefill

  • Manual Burst Test Mode
    • Multiple levels of control for optimal test
      results: Ramp Rate, Porous vs. Non-
      Porous Packages, Max/Min Acceptance
      Limits, Pressure Drop Sensitivity

  • High Performance
    • Higher Pressure Resolution (0.01 psi burst, 0.001 leak)
    • Automatic Regulator (fast pressure setting)
    • High Flow Capacity (up to 15 CFM)
    • Low Pressure Sensitivity at 5 InH2O

  • Advanced, user-defined interface compatible with USB keyboards, mice, bar code readers

  • Low Power Stand-by Mode for energy conservation

  • Graphical test plot display for leak, burst and creep tests

  • High Resolution Color LCD Display with Touchscreen

  • Standard and Metric units

  • Test data exporting to PC using Flash Drive

Brochure and Specification Sheet PDF

Request for Quotation or Information

Home | Products | Company Background | News & Events | Press Releases
  Service | TME Resources | Tools | Contact Us | Site Map
Leak, Flow and Package Testing 101

TM Electronics, Inc.
45 Main Street , Boylston, MA 01505
Tel: (508) 869-6400 | Toll Free: (800) 370-0501 | Fax: (508) 869-9955

© Copyright 2010 - TM Electronics, Inc. - All Rights Reserved
air flow testing, air leak detection, air leak test, air pressure decay, blister testing, bubble leak testing of porous packaging, burst strength test, burst testing, card and blister packaging, component leak testing, compressed air leak testing, creep rupture testing, creep testing, creep to failure, fda qsr, flexible packages, flow testing, gross leak and fine leak testing, how to do package design testing, induction seal testing, iso 11607, leak detection, leak rates, leak testing, mass flow, medical devices, medical package testing, membrane burst strength test, package integrity testing, package testing, packaging, pressure decay, quality control, seal strength testing, seals, t.m. electronics, tm electronics, vacuum leak testing, validation, why package testing