TMElectronics,
Inc.
Specialists in Leak, Flow and Package Testing
TM
Electronics, Inc.
45 Main Street
Boylston, MA 01505
For
Immediate Release
01/30/04
Contact: Karen Franks
Tel: (508) 869-6400
Fax: (508) 869-9955
Email: karen.franks@tmelectronics.com
Website: www.tmelectronics.com
TME
MDT-500SG Force Decay Leak Test System for Industrial,
Medical, Food and Pharmaceutical
Applications
Boylston,
MA: The TM Electronics TME MDT-500SG Force Decay Test System for non-destructive
leak testing of flexible packages is particularly suited to pouch forms using
non-porous materials such as films, foil or laminates. This method presents advantages
in speed and control for peel open package forms used in food, medical device
and pharmaceutical products.
When
a package with internal headspace is placed in a vacuum chamber, a differential
pressure is created across the package walls of the non-porous materials. Using
a restraining plate to prevent the full expansion of the package results in forces
being applied to the plate from the package walls. When the restraining plate
is attached to a force transducer, then the applied force from the expanded package
is measured relative to the differential pressure applied in the vacuum chamber.
The
TME MDT-500SG Force Decay Leak Test System is highly sensitive (detecting micron-sized
holes) and highly repeatable. Results are quantitative, and provide real time
statistical analysis and quality control charts. The system is scalable to in-line
package testing. The TME Force Decay Test System is custom designed for your particular
package. Contact an Applications Specialist at TME to discuss your force-decay
application.
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